A quick drying, mildly activated (RMA type) no-clean flux for use when removing and replacing surface mount components. Particularly recommended for precision products e.g. telecommunications or professional computers where a high degree of reliability is required.
Aids reflow when heating to remove components
Apply to solder pads for placement of new components
Use as an anti-tarnish, protective film on bare copper
Provides excellent solderability for up to six months
Zero halide content so no cleaning is required
Passes copper plate and copper mirror corrosion tests
Use with hot air, hot gas or conventional soldering
This makes a huge improvement when soldering lead-free joints. The solder flows much better and faster. The difference is amazing. One pen lasts for a very long time indeed if you take care of the tip.
